Thin-film deposition is one of the core processes in semiconductor manufacturing, and the Showerhead gas distribution plate plays a pivotal role in it. It acts like a precise gas distributor, evenly delivering reaction gases to the wafer surface and creating an ideal environment for thin-film formation. AMTD fully recognizes the importance of the gas distribution plate in thin-film deposition processes and regards it as a key factor in ensuring product quality.
During thin-film deposition, the uniform distribution of gases is of paramount importance. If the gas distribution is uneven, it will result in inconsistent thin-film thickness, thereby affecting the electrical performance of semiconductor devices. Through its carefully designed hole structure, the gas distribution plate can distribute gases with uniform pressure and flow rate to all areas of the wafer. In actual production, AMTD achieves precise control over thin-film thickness by accurately regulating the gas distribution of the gas distribution plate. For example, in the production of some products with extremely high requirements for thin-film uniformity, AMTD selects high-performance gas distribution plates, enabling the thin-film thickness deviation to be controlled within a very small range and improving product performance and consistency.
From a technical parameter perspective, the hole diameter tolerance of the gas distribution plate is controlled within ±0.005 mm, ensuring that the gas flow rate through each small hole is basically the same. During production, AMTD strictly monitors the hole diameter tolerance of the gas distribution plate because it directly affects the uniformity of gas distribution. The application of ALD (Atomic Layer Deposition) nano-coating technology further enhances the surface performance of the gas distribution plate, reducing gas adsorption and reaction and improving gas transmission efficiency.
When selecting gas distribution plates, AMTD gives priority to products that adopt this advanced coating technology. Cleanliness detection methods such as QIII/LPC/ICP - MS are used to ensure that the gas distribution plate is not contaminated during the manufacturing process, preventing impurities from affecting thin-film quality. AMTD is well aware of the hazards of impurities to semiconductor products and thus has extremely high cleanliness requirements for gas distribution plates.
Different types of gas distribution plates are suitable for different thin-film deposition processes. For instance, heated chamber gas distribution plates can play a role in processes where reaction gases need to be heated. By controlling the chamber temperature, they optimize the reaction conditions of the gases. In some special thin-film deposition processes, AMTD selects heated chamber gas distribution plates to improve reaction efficiency and thin-film quality. Chamber cross-hole welded gas distribution plates, on the other hand, may improve gas mixing and distribution effects through their special hole structures, and AMTD also selects them according to specific process requirements.
As semiconductor devices evolve towards smaller sizes and higher performance, thin-film deposition processes place increasingly higher demands on gas distribution plates. AMTD will continuously explore and adopt more advanced gas distribution plate technologies to meet the market demand for high-performance semiconductor products.
