
In semiconductor manufacturing, the Inductively Coupled Plasma (ICP) etching process is closely related to the design, production, and machining of the machined Showerhead (gas distribution showerhead). As a core component of ICP etching equipment, the Sh
Time:2025-11-19
In semiconductor manufacturing, the Showerhead (gas distribution shower nozzle) serves as a core component in processes such as thin-film deposition and etching. Its performance directly impacts the uniformity and yield of wafer processing. Given that Sho
Time:2025-11-19
In the field of semiconductor manufacturing, the Showerhead (gas distribution shower nozzle), as a core component, has its welding process directly impacting the uniformity of gas distribution, sealing performance, and equipment durability. Since the Show
Time:2025-11-19
In the field of semiconductor manufacturing, the surface treatment processes of Showerheads (shower nozzles/gas distribution plates) are of crucial importance for enhancing their performance, durability, and reliability. Here are several key surface treat
Time:2025-11-19
1.Reducing Impurities and Contamination: Under normal temperature and pressure, impurities in the environment such as dust, water vapor, and oxygen can have a severe impact on the manufacturing of semiconductor chips. For example, the presence of metal pa
Time:2025-11-19
Vacuum coating is aimed at reducing the interference of impurity deposition to ensure the purity of the coating layer, and this requirement is closely related to the production and processing of Showerheads (shower nozzles/gas distribution plates). The sp
Time:2025-11-19
In the field of semiconductor manufacturing, the Showerhead (spray head/gas distribution plate) serves as the core component of the gas distribution system, with its performance having a decisive impact on the uniformity of thin-film deposition on wafer s
Time:2025-11-12
In the field of semiconductor manufacturing, the Showerhead (spray head/gas distribution plate) serves as the core component of the gas distribution system, with its performance having a decisive impact on the uniformity of thin-film deposition on wafer s
Time:2025-11-11
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