In the field of semiconductor manufacturing, the Showerhead (spray head/gas distribution plate) serves as the core component of the gas distribution system, with its performance having a decisive impact on the uniformity of thin-film deposition on wafer surfaces, etching precision, and the stability of plasma distribution. As advanced processes advance towards the 3nm node and below, higher requirements are imposed on the microhole size and surface quality of Showerheads. Against this backdrop, atomic layer deposition (ALD) technology, with its unique self-limiting surface reaction mechanism, demonstrates significant application potential in Showerhead manufacturing.
I. Principles and Advantages of ALD Technology
Atomic layer deposition (ALD) technology is a thin-film deposition technique based on self-limiting surface reactions. It deposits thin films layer by layer on a substrate surface by alternately introducing precursor gases. The principle lies in the fact that after each precursor gas undergoes a chemical reaction on the substrate surface, a dense thin film is formed, preventing further reactions of subsequent precursor gases. By cyclically introducing different precursor gases, nano-scale precision thin-film deposition can be achieved.
The advantages of ALD technology in Showerhead manufacturing are primarily reflected in the following aspects:
1.High-Precision Correction: ALD technology enables nano-scale precision aperture correction. Depositing 100 cycles (approximately 10nm) of SiO₂ can reduce the aperture by 0.2μm, with a correction accuracy of ±0.05μm. This helps meet the high requirements for Showerhead microhole size in advanced processes.
2.Excellent Uniformity: The thin films deposited by ALD exhibit extremely high uniformity, with coating thickness deviations controllable within a minimal range. This helps maintain the stability of Showerhead surface quality, improving semiconductor manufacturing yields and reliability.
3.Wide Material Applicability: ALD technology can deposit thin films of various materials, including dense ceramic materials such as aluminum oxide, silicon nitride, and fluorides, as well as hydrophobic polymers. This provides more options for the surface functionalization treatment of Showerheads.
4.Non-Destructive Processing: ALD technology is a non-destructive processing technique that does not cause thermal or mechanical damage to the substrate. This helps maintain the integrity of the Showerhead's microstructure, improving its corrosion resistance and stability.
II. Application Cases of ALD Technology in Showerhead Manufacturing
Taking Applied Materials' ALD Showerhead as an example, it requires long-term exposure to chlorine-containing etching gases (Cl₂, BCl₃) in 3D NAND manufacturing. To enhance the corrosion resistance of the Showerhead, Applied Materials employed ALD technology to deposit a 100nm Al₂O₃ coating, reducing the corrosion rate from 0.5nm/h to 0.02nm/h and extending its lifespan to over 2000 hours. This case fully demonstrates the significant effect of ALD technology in improving the corrosion resistance of Showerheads.
In addition, ALD technology is also applied to aperture correction and surface functionalization treatment of Showerheads. In EUV lithography mask manufacturing, Tokyo Electron utilized ALD technology to reduce the coefficient of variation (CV) value of Showerhead nozzle diameters from ±3% to ±0.5%, significantly improving the uniformity of photoresist exposure. Meanwhile, by depositing fluorides or hydrophobic polymers via ALD, the surface energy of the Showerhead can be reduced, minimizing particle shedding and further enhancing semiconductor manufacturing yields and reliability.
III. Challenges and Future Prospects of ALD Technology
Despite the significant application potential of ALD technology in Showerhead manufacturing, it still faces some challenges. Firstly, the investment cost of ALD equipment is relatively high, limiting its widespread application in mid-to-low-end processes. Secondly, the deposition rate of ALD is relatively slow, making it difficult to meet the demands of large-scale production. Additionally, ALD technology has high requirements for the purity and quality of precursor gases, increasing raw material costs and the difficulty of supply chain management.
However, with continuous technological advancements and gradual cost reductions, ALD technology is expected to play a more significant role in Showerhead manufacturing. In the future, through measures such as optimizing ALD process parameters, increasing deposition rates, and reducing equipment costs, ALD technology will achieve more efficient and cost-effective processing. Meanwhile, as semiconductor manufacturing technologies continue to evolve, the performance requirements for Showerheads are also constantly increasing. ALD technology will be combined with other advanced technologies to jointly drive Showerhead manufacturing towards higher precision, lower costs, and greater intelligence.
AMTD provides high-precision Showerhead (spray head/gas uniformity plate/gas distribution plate) services for core components. Its products mainly include Shower heads, Face plates, Blocker Plates, Top Plates, Shields, Liners, pumping rings, Edge Rings, and other core semiconductor equipment components. These products are widely used in semiconductor and display panel fields, exhibiting excellent performance and high market recognition.
Content Source: Compiled from "ALD and Showerhead: Technological Synergy, Application Empowerment, and Collaborative Innovation", "Analysis of Showerhead (Spray Head/Gas Distribution Plate) Production and Processing Technologies", and relevant industry reports.
