In the precision-driven world of semiconductor manufacturing, the Showerhead (also known as a gas distribution plate or spray head) serves as the core component of gas distribution systems. Its performance directly determines the uniformity of thin-film deposition, etching precision, and stability of plasma distribution on wafer surfaces. As advanced manufacturing processes advance toward the 3nm node and beyond, Showerhead manufacturing technology faces unprecedented challenges. Global leading companies are redefining the limits of this "small-hole, big-technology" field through material innovation, process breakthroughs, and intelligent upgrades.
1. Material Revolution: From Metals to Ceramics
The selection of materials for Showerheads must balance high-temperature resistance, corrosion resistance, and thermal expansion compatibility. Traditional aluminum alloys (e.g., 6061-T6) remain widely used in mid-to-low-end processes due to their good thermal conductivity and low processing costs. However, in high-end applications, nickel-based alloys and titanium alloys are becoming mainstream due to their superior resistance to plasma bombardment. For example, in Applied Materials' ALD (Atomic Layer Deposition) equipment, Showerheads with titanium alloy substrates, combined with ALD coating technology, have extended corrosion resistance lifetimes from 500 hours to over 2000 hours.
The rise of non-metallic materials is even more significant. CVD-SiC (Chemical Vapor Deposition Silicon Carbide), AlN (Aluminum Nitride), and high-purity ceramics are widely used in critical processes such as Extreme Ultraviolet Lithography (EUV) and ALD due to their high-temperature resistance (>600°C) and thermal expansion coefficients close to those of silicon wafers. For instance, Tokyo Electron's (TEL) EUV Showerhead, made of CVD-SiC material, reduces the film thickness deviation between wafer edges and centers from ±3% to ±0.8% by optimizing pore size distribution and flow channel design, significantly improving yield.
2. Micropore Processing: Breakthroughs from Microns to Sub-Microns
The micropore array is the core functional unit of Showerheads. A Showerhead for 12-inch wafers requires over 100,000 micropores, with pore diameters approaching 30 μm, a pore density of 1200 holes/cm², and precise control of gas injection angles to avoid turbulence. Traditional mechanical drilling and Electrical Discharge Machining (EDM) are no longer sufficient due to their large heat-affected zones (HAZ) and low efficiency.
Femtosecond laser cold processing has emerged as a disruptive technology. Its ultrashort pulses (<10⁻¹⁵ seconds) enable "heat-free" processing, achieving a pore wall roughness (Ra) of <0.2 μm, pore diameter deviations of ≤±1 μm, and the ability to machine hard materials like CVD-SiC. Anhui Boxinwei Semiconductor Technology Co., Ltd. has enhanced pore wall perpendicularity to 90°±0.5° using a "laser + grinding" composite process, meeting the requirements of 5nm processes. Additionally, Atomic Layer Deposition (ALD) technology enables nanoscale pore size correction—each deposition of 100 cycles (approximately 10 nm) of SiO₂ reduces pore diameter by 0.2 μm with a correction accuracy of ±0.05 μm.
3. Intelligence and Localization: From Cost Reduction to Ecosystem Transformation
Despite the significant performance improvements brought by femtosecond laser and ALD technologies, their high costs (equipment prices exceeding $5 million) and low efficiency (daily output of 5–10 wafers per unit) remain bottlenecks. To address these challenges, the industry is exploring three key directions:
1.Spatial ALD Technology: By employing parallel precursor injection, deposition rates are increased to 1 μm/min, reducing costs by 60%.
2.AI Simulation Optimization: Leveraging ANSYS Fluent combined with machine learning shortens gas flow channel design cycles by over 30%.
3.Accelerated Localization: The autonomy of domestic equipment has driven the localization rate of the supply chain from 15% to 40%.
4. Future Outlook: Evolution from Components to Systems
Showerhead manufacturing is transitioning from optimizing individual components to developing system-level solutions. With the deep integration of materials science, intelligent manufacturing, and AI technologies, Showerheads are evolving toward higher precision, lower costs, and greater intelligence, providing critical support for continuous innovation in the semiconductor industry.
AMTD offers high-precision Showerhead (spray head/gas distribution plate/uniform gas plate) services for core components. Its product lineup includes Showerheads, Face Plates, Blocker Plates, Top Plates, Shields, Liners, Pumping Rings, Edge Rings, and other critical semiconductor equipment parts. These products are widely used in semiconductor and display panel industries, delivering exceptional performance and high market recognition.
Content Sources:
Tokyo Electron (TEL) Technical White Paper: Application of ALD in Showerhead Manufacturing
Lam Research: Core Component Processing Technologies for Semiconductor Equipment
