Micropore processing technology, as one of the core technologies in precision manufacturing, finds widespread applications across multiple high-tech industries, including semiconductors, aerospace, healthcare, and electronics. With continuous technological advancements, micropore processing technology has undergone constant innovation and development, evolving from traditional mechanical processing and electrical discharge machining (EDM) to modern laser processing and composite processing techniques. These breakthroughs have continuously enhanced precision and efficiency.
I. Traditional Micropore Processing Technologies and Their Limitations
Mechanical Processing: This includes drilling, milling, and planing, relying on hard alloy tools or micro-drills. While cost-effective, it faces challenges in deep-hole processing, such as difficulties in chip removal and heat dissipation, tool wear and breakage, and limited capability to process high-hardness materials. For instance, mechanical processing is nearly impossible for high-hardness non-metallic materials like CVD-SiC.
Electrical Discharge Machining (EDM): EDM utilizes high-frequency pulse discharge to erode materials, suitable for conductive metals regardless of their hardness. However, it generates a heat-affected zone (HAZ), resulting in a recast layer on the processed hole walls that requires subsequent acid pickling for removal. Additionally, EDM has relatively slow processing speeds and electrode wear.
Chemical Etching: This method defines hole arrays through masking and corrodes materials using chemical solutions. However, chemical etching suffers from isotropic corrosion, leading to conical hole walls that affect gas jet directionality. Moreover, the masking precision limits its ability to meet hole diameter requirements below 30μm.
II. Innovations in Modern Micropore Processing Technologies
Laser Processing: Laser processing has become a core technology in precision manufacturing due to its non-contact nature, high efficiency, and versatility across various materials. Particularly, ultrafast lasers like femtosecond and picosecond lasers achieve "cold processing" through ultra-short pulses, avoiding HAZ. They can control hole diameter deviations within ±1μm and achieve hole wall roughness (Ra) of less than 0.2μm. Laser processing also allows for the fabrication of micropores with arbitrary shapes, offering high flexibility and suitability for various hard and brittle materials and high-hardness metals.
Composite Processing Techniques: These techniques combine the advantages of multiple processing methods to achieve higher precision and efficiency. For example, the "laser + grinding" collaborative process first rapidly forms micropore arrays through laser roughing, followed by precision polishing of the hole walls using diamond grinding to eliminate taper and burrs left by laser processing. This technique has been widely applied in Showerhead manufacturing, significantly improving processing precision and efficiency.
Electrical Processing Technology Innovations: Traditional methods often struggle with insulating ceramic materials. Micro-EDM addresses this challenge by using conductive phase-modified ceramics and nano-graphite powder working fluids, enabling precise processing of insulating ceramics through discharge-generated high temperatures. Additionally, Electrohydraulic Flow (EHF) processing utilizes high-pressure electrolytes carrying abrasives to impact ceramic material surfaces, achieving material removal with an aspect ratio of up to 30:1, providing efficient solutions for manufacturing key components in the aerospace sector.
III. Application Fields of Micropore Processing Technologies
Semiconductor Manufacturing: In semiconductor manufacturing, the Showerhead serves as a core component of the gas distribution system, and its micropore processing precision directly impacts the uniformity of thin-film deposition, etching accuracy, and plasma distribution stability on wafer surfaces. As advanced processes advance to the 3nm node and beyond, Showerhead micropore processing precision requirements have escalated to the sub-micron level.
Aerospace: In aviation engine combustion chambers, micropore processing on SiC/SiC composite material injector plates enhances fuel atomization efficiency and temperature uniformity, significantly improving engine combustion efficiency and performance.
Healthcare: In brain-machine interface ceramic probes, micropore arrays processed on zirconia substrates enable high-fidelity acquisition of neuronal signals, providing crucial technical means for the clinical application of brain-machine interface technology and neuroscientific research.
Electronics: In inkjet printer nozzle manufacturing, laser drilling technology produces micropores with good roundness, low taper, minimal debris, and smooth inner walls, improving print quality and efficiency. In printed circuit board (PCB) manufacturing, laser drilling enables the processing of micro-blind vias, meeting product miniaturization demands.
IV. Future Outlook
With continuous technological advancements and increasing demands for precision processing in manufacturing, micropore processing technology will continue to evolve towards higher precision, efficiency, and cost-effectiveness. In the future, the development and application of technologies such as spatial atomic layer deposition (ALD), AI simulation optimization, and accelerated localization of substitutes will usher in broader prospects for micropore processing technology. Simultaneously, the emergence of new materials and processes will drive continuous innovation and breakthroughs in micropore processing technology, providing more robust technical support for the development of high-tech fields.
AMTD provides high-precision Showerhead (spray head/gas uniformity plate/gas distribution plate) services for core components. Its product range includes Showerheads, Face plates, Blocker Plates, Top Plates, Shields, Liners, pumping rings, Edge Rings, and other semiconductor equipment core parts. These products are widely used in semiconductors, display panels, and other fields, demonstrating exceptional performance and high market recognition.
Content Sources: News (Sohu) "In-Depth Analysis of Laser Micro-Drilling Technology: Materials, Mechanisms, Methods, and Applications," NetEase "Comprehensive Analysis of Ceramic Deep Micropore Processing Techniques," Elecfans "Micropore Processing - Elecfans," Zhihu Column "Showerhead Micropore Processing: Precision Challenges and Breakthroughs in Semiconductor Manufacturing."
