I. Technical Compatibility: ALD Characteristics Precisely Match Showerhead Performance Requirements
Thickness Uniformity Control
ALD achieves layer-by-layer deposition by alternately introducing precursor gases, with a single-layer thickness controllable to 0.1 - 0.3 nm, ensuring a coating thickness uniformity within ±1%. This characteristic is crucial for the inner wall coating of Showerhead microholes (with diameters ranging from 5 - 50 μm), as it can avoid the non-uniform coating caused by the shadow effect in traditional CVD processes. For example, research by Tokyo Electron shows that ALD coatings reduce the deviation in coating thickness between the corner and flat areas of Showerhead flow channels to less than 5%, significantly improving gas distribution uniformity.
Complex Structure Coverage Capability
ALD can achieve 100% step coverage in three-dimensional structures (such as the spiral flow channels and deep holes of Showerheads), while PVD processes typically have a coverage rate of less than 70%. This advantage ensures the gas transmission efficiency within the internal flow channels of Showerheads, reducing gas turbulence or local concentration non-uniformity caused by coating defects.
Low-Temperature Deposition Advantage
ALD can perform deposition at temperatures between 100 - 300℃, much lower than the 400 - 600℃ required by traditional CVD processes, preventing thermal stress deformation of stainless steel substrates due to high temperatures. The ALD process developed by Applied Materials has reduced the deformation of Showerhead substrates from 15 μm to 3 μm, extending the equipment's service life.
II. Four Core Application Scenarios: ALD Empowers Showerhead Performance Upgrades
Anti-Corrosion Coatings
Material Selection: Dense ceramic materials such as aluminum oxide (Al₂O₃) and silicon nitride (Si₃N₄).
Case Study: In 3D NAND manufacturing, Showerheads need to be in long-term contact with chlorine-containing etching gases (Cl₂, BCl₃). Lam Research uses ALD to deposit a 100 nm Al₂O₃ coating, reducing the corrosion rate from 0.5 nm/h to 0.02 nm/h and extending the service life to over 2000 hours.
Anti-Pollution Coatings
Surface Functionalization: By depositing fluorides (such as AlF₃) or hydrophobic polymers through ALD, the surface energy is reduced.
Case Study: Applied Materials' ALD-AlF₃ coating increases the contact angle of the Showerhead surface from 65° to 120°, reduces particle shedding by 80%, and improves wafer yield by 1.2% in logic chip manufacturing.
Precise Aperture Control
Process: First, the initial aperture is prepared through electrical discharge machining (EDM), and then the size is adjusted by depositing SiO₂ using ALD. Each deposition of 100 cycles (approximately 10 nm) can reduce the aperture by 0.2 μm, achieving nanoscale precision control.
Case Study: In EUV lithography mask manufacturing, Tokyo Electron uses this technology to reduce the coefficient of variation (CV) of the Showerhead nozzle diameter from ±3% to ±0.5%, significantly improving the uniformity of photoresist exposure.
Ion Bombardment Resistance Enhancement
Process: First, a 50 nm Y₂O₃ layer is deposited as an adhesion layer through ALD, and then a thick SiC layer is deposited using CVD as a structural layer, solving the problem of coating peeling during direct CVD deposition.
Case Study: This process increases the ion bombardment resistance life of the Showerhead in ALE (Atomic Layer Etching) equipment from 500 hours to 2000 hours.
III. Collaborative Innovation: Process Breakthroughs in ALD and Showerhead
Cost-Effectiveness Optimization
Cost Comparison: Taking a 12-inch Showerhead as an example, although the ALD process increases the coating cost by 150perpiece,itextends the service life from 500hours to 2000hours and reduces waferdefects(improving the yield by1.24.8 million.
New Material Research and Development
Research Direction: New ALD precursors such as two-dimensional materials (e.g., h-BN) and metal-organic frameworks (MOFs) are under development, which are expected to further enhance the high-temperature resistance (>600℃) and chemical stability of Showerheads.
Process Efficiency Improvement
Spatial ALD Technology: By simultaneously spraying multiple precursors, the deposition rate can be increased from 50 - 100 nm/min to 1 μm/min, and it has entered the stage of industrial verification.
Cost Reduction: Through a precursor recovery system (with a recovery rate > 95%) and process parameter optimization (such as shortening the purge time), the cost of ALD coatings can be reduced from 500/m2to200/m², approaching the level of traditional PVD processes.
AMTD provides high-precision Showerhead (showerhead/gas distribution plate/gas diffuser) services for core components. Its products mainly include Showerhead, Face plate, Blocker Plate, Top Plate, Shield, Liner, pumping ring, Edge Ring, and other core semiconductor equipment parts. These products are widely used in fields such as semiconductors and display panels, with excellent performance and high market recognition.
Content Source: Compiled from industry research reports, publicly available technical data from companies such as Tokyo Electron, Lam Research, and Applied Materials, as well as related news and information.
