In the era of rapid development in the semiconductor and high-tech industries, the performance of semiconductor components directly determines the stability of the entire production process and the reliability of product quality. Surface treatment processes, as a crucial link in enhancing the performance of semiconductor components, act like a magical "makeup artist," endowing components with exceptional characteristics and strong competitiveness. As a player in the industry, AMTD deeply understands the importance of surface treatment processes and has consistently explored and innovated in this field.
The surface treatment processes for semiconductor components constitute a complex and delicate systematic project, encompassing multiple processes such as physical polishing, sandblasting, chemical cleaning, anodizing, nickel brush plating, ceramic spraying, Teflon coating, and final cleaning in a cleanroom. These processes are interconnected and indispensable.
Chemical cleaning marks the starting point and a vital step in the entire surface treatment process. During the manufacturing and transportation of semiconductor components, their surfaces inevitably become contaminated with various impurities, such as oil stains, dust, and metal particles. These impurities are like hidden "time bombs" on the component surfaces; if not promptly removed, they will severely affect the effectiveness of subsequent treatment processes and even lead to a decline in component performance. Chemical cleaning, by utilizing specific chemical solutions, can precisely eliminate these surface impurities, laying a clean and stable foundation for subsequent treatments, much like laying a solid foundation for a building.
Anodizing further enhances the corrosion resistance of components based on chemical cleaning. After anodizing treatment, a dense oxide film forms on the component surface, acting like a sturdy "armor" that effectively blocks the intrusion of external corrosive substances, significantly extending the service life of the components. In harsh working environments, this oxide film ensures the stable operation of components, providing a strong guarantee for the continuity of semiconductor production.
Nickel brush plating primarily targets improving the surface wear resistance of components. During semiconductor manufacturing, components frequently come into contact and rub against other parts. If the surface wear resistance is insufficient, wear and damage are prone to occur, affecting production efficiency and product quality. Nickel brush plating increases the surface hardness and wear resistance by depositing a nickel layer on the component surface, enabling the components to withstand high-intensity friction and wear and maintain long-term stable performance.
Leveraging advanced surface treatment processes and a stringent quality control system, AMTD organically combines processes such as physical polishing, sandblasting, ceramic spraying, and Teflon coating with the aforementioned key processes. This results in components exhibiting excellent performance in terms of wear resistance, corrosion resistance, electrical conductivity, and cleanliness, meeting the increasingly high standards of the semiconductor and high-tech industries and contributing to the advancement of the industry.
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