Inspection Capabilities — Full-Dimensional Quality Control from Micro to Macro

Quality control for semiconductor equipment components must cover the full spectrum — from microscopic film layers to macroscopic dimensions. The establishment of a comprehensive inspection system is the fundamental guarantee that every product leaving the factory can withstand the most rigorous testing.

 

Surface Treatment Inspection: Let the Data Speak

Salt spray testing and HCL bubble testing verify the long-term reliability of surface treatments under accelerated corrosion conditions. The measured breakdown voltage of mixed-acid hard anodizing reaches 4.2KV–4.65KV, significantly outperforming the industry standard of 2.8KV–3.4KV. The company is also equipped with a full suite of inspection instruments, including surface roughness testers, eddy current film thickness testers, and high-voltage withstand testers.

 

Machining Inspection: Reverse Engineering Capability

High-precision equipment such as Coordinate Measuring Machines (CMM), Vision Measuring Machines (VMM), and flatness testers provide rapid and efficient inspection services. Of even greater strategic value is the company's capability in reverse engineering development for various products — a critical advantage in the wave of domestic substitution.

 

Eight Inspection Dimensions, Zero Blind Spots

From dark light inspection (UV), gas flow detection, and organic contamination analysis, to micro-particle detection, surface metal trace analysis, material composition analysis, liquid particle count detection, and chemical residue analysis — eight inspection dimensions achieve complete, zero-blind-spot coverage of product quality.

 

AMTD, with its full-dimensional inspection system spanning from microscopic film layers to macroscopic dimensions, provides the strongest endorsement for the reliability of every product. In the semiconductor industry, quality is the lifeline.